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Intel’s progress with 18A wafers
On Tuesday, Intel announced that its Arizona fabrication facility has successfully processed the initial batches of its cutting-edge Intel 18A wafers. This innovative manufacturing technology is set to power the upcoming Panther Lake chips. During the Foundry Direct Connect symposium, Intel also introduced a high-performance derivative process, signaling a robust commitment to advancing its manufacturing capabilities.
Despite the enthusiastic presentations from Intel executives regarding their foundry roadmap, the direction of Intel’s manufacturing processes is heavily influenced by the products consumers will eventually purchase. The Panther Lake processors, set to utilize the Intel 18A process node, mark a significant milestone in achieving the ambitious goal of launching five nodes within four years, as outlined by former CEO Pat Gelsinger. Following this, the anticipated 14A technology is expected to be the backbone for the Nova Lake processors, projected for release in 2026.
Strategic shift towards in-house production
In a strategic move to enhance efficiency and reduce costs, Intel has relied on its foundry partner TSMC for various components within its disaggregated processors, including the Lunar Lake series. However, Intel is now transitioning to bring more of this production in-house. This shift not only promises to save the company money but also aims to demonstrate to its customers that Intel can compete effectively with TSMC in the semiconductor manufacturing landscape.
According to Intel’s CEO, Lip-Bu Tan, the 18A process is currently in ‘risk production’ and is expected to enter volume production within the year. The Intel 18A process incorporates advanced technologies like RibbonFET, a next-generation transistor design that offers improved performance, and PowerVia, a unique backside power delivery architecture intended to boost power performance by up to 4 percent. The announcement emphasizes that Intel is poised for a full product design start, indicating readiness to proceed with this cutting-edge technology.
Introducing the 18A derivatives
In addition to the standard 18A process, Intel has introduced two new variants: the 18A-P, aimed at enhancing performance for a select group of customers, and the 18A-PT, which builds upon the performance and power efficiency of the 18A process. Intel has disclosed that early wafers utilizing the 18A-P variant are already in production at the fab. Moreover, the 18A-PT variant can be connected to the top die using Foveros Direct 3D technology, boasting a hybrid bonding interconnect pitch of less than 5 micrometers.
The upcoming 14A process is set to further improve upon the 18A process, introducing a new power delivery network called PowerDirect, which represents a significant advancement in power management. Additionally, the next generation of RibbonFET, dubbed RibbonFET 2, is expected to enhance the capabilities of its predecessor.
Turbo cells and their implications
One of the most intriguing aspects of the new 14A process is the introduction of ‘turbo cells,’ which Intel describes as a ‘boosted cell technology.’ This innovative feature aims to optimize performance by enabling a mix of high-performance and power-efficient cells within a design block. This tailored approach allows designers to achieve a balanced trade-off between power consumption, performance, and area, catering to various applications.
When combined with RibbonFET 2, turbo cells are anticipated to significantly enhance speed, particularly in maximizing CPU frequency and GPU critical paths. This technology could prove essential as Intel, along with other chip manufacturers, continually seeks ways to elevate chip performance amidst growing competition.
Future prospects with advanced packaging technologies
Intel’s developments don’t stop at the 14A and 18A processes; the company is also innovating in packaging technologies. Intel revealed that dies produced using the 14A and 18A-PT processes can be seamlessly integrated, utilizing Foveros Connect 3D stacking and Embedded Multi-Die Interconnect Bridge (EMIB) technologies. Furthermore, Intel is working on EMIB-T to address future high-bandwidth memory requirements, along with introducing two new Foveros variants: Foveros-R and Foveros-B, which promise to enhance the versatility of their semiconductor solutions.
With decades of experience in the tech industry, Intel’s advancements in semiconductor manufacturing are set to reshape the landscape of high-performance computing. As they move forward with these revolutionary technologies, the implications for both the industry and consumers are profound, marking a new era in chip design and manufacturing.